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Jingdong book

国外电子与通信教材系列·芯片制造：半导体工艺制程实用教程（第六版）

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Jingdong book

国外电子与通信教材系列·芯片制造：半导体工艺制程实用教程（第六版）

Name: 国外电子与通信教材系列·芯片制造：半导体工艺制程实用教程（第六版）
Brand: Jingdong book
SKU: 3101003771
Price: 46.25 USD
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《国外电子与通信教材系列·芯片制造：半导体工艺制程实用教程（第六版）》是一本介绍半导体集成电路和器件制造技术的专业书籍，第六版内容全面、工艺先进，在半导体领域享有很高的声誉。

Content Description

《国外电子与通信教材系列·芯片制造：半导体工艺制程实用教程（第六版）》是一本介绍半导体集成电路和器件制造技术的专业书籍，在半导体领域享有很高的声誉。本书的讨论范围包括半导体工艺的每个阶段：从原材料的制备到封装、测试和成品运输，以及传统的和现代的工艺。《国外电子与通信教材系列·芯片制造：半导体工艺制程实用教程（第六版）》提供了详细的插图和实例，每章包含回顾总结和习题，并辅以丰富的术语表。第六版修订了微芯片制造领域的新进展，讨论了用于图形化、掺杂和薄膜步骤的先进工艺和尖端技术，使隐含在复杂的现代半导体制造材料与工艺中的物理、化学和电子的基础信息更易理解。《国外电子与通信教材系列·芯片制造：半导体工艺制程实用教程（第六版）》的主要特点是避开了复杂的数学问题介绍工艺技术内容，并加入了半导体业界的新成果，可以使读者了解工艺技术发展的趋势。

Author Description

韩郑生，男，中科院微电子研究所研究员/教授，博士生导师，研究方向为微电子学与固体电子学，从事集成电路工艺技术、电路设计方面的工作，曾任高级工程师，光刻工艺负责人，研究室副主任兼任测试工艺负责人，硅工程中心产品部主任，项目/课题负责人。国家特殊津贴获得者。国家自然基金面上项目评审专家。

Catalogue

第1章半导体产业
1．1 引言
1．2 一个产业的诞生
1．3 固态时代
1．4 集成电路
1．5 工艺和产品趋势
1．6 半导体产业的构成
1．7 生产阶段
1．8 微芯片制造过程发展的
60年
1．9 纳米时代
习题
参考文献

第2章半导体材料和化学品的特性
2．1 引言
2．2 原子结构
2．3 元素周期表
2．4 电传导
2．5 绝缘体和电容器
2．6 本征半导体
2．7 掺杂半导体
2．8 电子和空穴传导
2．9 半导体生产材料
2．10 半导体化合物
2．11 锗化硅
2．12 衬底工程
2．13 铁电材料
2．14 金刚石半导体
2．15 工艺化学品
2．16 物质的状态
2．17 物质的性质
2．18 压力和真空
2．19 酸、碱和溶剂
2．20 化学纯化和清洗
习题
参考文献

第3章晶体生长与硅晶圆制备
3．1 引言
3．2 半导体硅制备
3．3 晶体材料
3．4 晶体定向
3．5 晶体生长
3．6 晶体和晶圆质量
3．7 晶圆准备
3．8 切片
3．9 晶圆刻号
3．10 磨片
3．11 化学机械抛光
3．12 背面处理
3．13 双面抛光
3．14 边缘倒角和抛光
3．15 晶圆评估
3．16 氧化
3．17 包装
3．18 工程化晶圆（衬底）
习题
参考文献

第4章晶圆制造和封装概述
4．1 引言
4．2 晶圆生产的目标
4．3 晶圆术语
4．4 芯片术语
4．5 晶圆生产的基础工艺
4．6 薄膜工艺
4．7 晶圆制造实例
4．8 晶圆中测
4．9 集成电路的封装
4．10 小结
习题
参考文献

第5章污染控制
5．1 引言
5．2 污染源
5．3 净化间的建设
5．4 净化间的物质与供给
5．5 净化间的维护
5．6 晶片表面清洗
习题
参考文献
第6章生产能力和工艺良品率
6．1 引言
6．2 良品率测量点
6．3 累积晶圆生产良品率
6．4 晶圆生产良品率的制约因素
6．5 封装和最终测试良品率
6．6 整体工艺良品率
习题
参考文献

第7章氧化
7．1 引言
7．2 二氧化硅层的用途
7．3 热氧化机制
7．4 氧化工艺
7．5 氧化后评估
习题
参考文献

第8章十步图形化工艺流程――从表面
制备到曝光
8．1 引言
8．2 光刻工艺概述
8．3 光刻十步法工艺过程
8．4 基本的光刻胶化学
8．5 光刻胶性能的要素
8．6 光刻胶的物理属性
8．7 光刻工艺：从表面准备到曝光
8．8 表面准备
8．9 涂光刻胶（旋转式）
8．10 软烘焙
8．11 对准和曝光
8．12 先进的光刻
习题
参考文献

第9章十步图形化工艺流程――从显影到最终检验
9．1 引言
9．2 硬烘焙
9．3 刻蚀
9．4 湿法刻蚀
9．5 干法刻蚀
9．6 干法刻蚀中光刻胶的影响
9．7 光刻胶的去除
9．8 去胶的新挑战
9．9 最终目检
9．10 掩模版的制作
9．11 小结
习题
参考文献

第10章下一代光刻技术
10．1 引言
10．2 下一代光刻工艺的挑战
10．3 其他曝光问题
10．4 其他解决方案及其挑战
10．5 晶圆表面问题
10．6 防反射涂层
10．7 高级光刻胶工艺
10．8 改进刻蚀工艺
10．9 自对准结构
10．10 刻蚀轮廓控制
习题
参考文献

第11章掺杂
11．1 引言
11．2 扩散的概念
11．3 扩散形成的掺杂区和结
11．4 扩散工艺的步骤
11．5 淀积
11．6 推进氧化
11．7 离子注入简介
11．8 离子注入的概念
11．9 离子注入系统
11．10 离子注入区域的杂质浓度
11．11 离子注入层的评估
11．12 离子注入的应用
11．13 掺杂前景展望
习题
参考文献

第12章薄膜淀积
12．1 引言
12．2 化学气相淀积基础
12．3 CVD的工艺步骤
12．4 CVD系统分类
12．5 常压CVD系统
12．6 低压化学气相淀积（LPCVD）
12．7 原子层淀积
12．8 气相外延
12．9 分子束外延
12．10 金属有机物CVD
12．11 淀积膜
12．12 淀积的半导体膜
12．13 外延硅
12．14 多晶硅和非晶硅淀积
12．15 SOS和SOI
12．16 在硅上生长砷化镓
12．17 绝缘体和绝缘介质
12．18 导体
习题
参考文献

第13章金属化
13．1 引言
13．2 淀积方法
13．3 单层金属
13．4 多层金属设计
13．5 导体材料
13．6 金属塞
13．7 溅射淀积
13．8 电化学镀膜
13．9 化学机械工艺
13．10 CVD金属淀积
13．11 金属薄膜的用途
13．12 真空系统
习题
参考文献

第14章工艺和器件的评估
14．1 引言
14．2 晶圆的电特性测量
14．3 工艺和器件评估
14．4 物理测试方法
14．5 层厚的测量
14．6 栅氧化层完整性电学测量
14．7 结深
14．8 污染物和缺陷检测
14．9 总体表面特征
14．10 污染认定
14．11 器件电学测量
习题
参考文献

第15章晶圆制造中的商业因素
15．1 引言
15．2 晶圆制造的成本
15．3 自动化
15．4 工厂层次的自动化
15．5 设备标准
15．6 统计制程控制
15．7 库存控制
15．8 质量控制和ISO 9000认证
15．9 生产线组织架构
习题
参考文献

第16章形成器件和集成电路的
介绍
16．1 引言
16．2 半导体器件的形成
16．3 可替换MOSFET按比例缩小的挑战
16．4 集成电路的形成
16．5 Bi MOS
16．6 超导体
习题
参考文献

第17章集成电路的介绍
17．1 引言
17．2 电路基础
17．3 集成电路的类型
17．4 下一代产品
习题
参考文献

第18章封装
18．1 引言
18．2 芯片的特性
18．3 封装功能和设计
18．4 引线键合工艺
18．5 凸点或焊球工艺示例
18．6 封装设计
18．7 封装类型和技术小结
习题
参考文献
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